SANTA CLARA, California, May 3, 2026 (GLOBE NEWSWIRE) — Applied Materials, Inc. today announced that it has entered into a definitive agreement with ASMPT Limited (HKEX: 0522) to acquire its NEXX business, a leading supplier of advanced large area packaging deposition equipment for the semiconductor industry. The addition of the NEXX team and products will broaden Applied’s portfolio of advanced panel-level packaging technologies, which are designed to enable chipmakers and systems companies to build larger-body AI accelerators for higher energy-efficient performance.
Increasing AI workloads require larger chiplet-based designs that integrate larger numbers of GPUs, high-bandwidth memory stacks (HBM), and input-output (I/O) chips into a single advanced package. As AI chip packages scale to more complex architectures such as 2.5D and 3D chiplet stacking, demand for larger interposers and advanced substrates is driving the transition from 300-millimeter silicon wafers to panel form factors as large as 510 by 515 millimeters or more, allowing designers to build larger AI chips and achieve significantly higher output.
Already a leading provider of advanced packaging technologies, Applied has been working to accelerate the transition to advanced panel substrates by developing a strong portfolio of manufacturing systems that include digital lithography, physical vapor deposition (PVD), chemical vapor deposition (CVD) and etching, along with eBeam metrology and inspection. The addition of NEXX’s panel-level electrochemical deposition (ECD) technology will broaden Applied’s portfolio and serve the addressable market, allowing Applied to develop co-optimized fine-pitch I/O wiring solutions and accelerate advanced packaging roadmaps for AI chipmakers and systems companies.
“NEXX joining Applied Materials complements our leadership in advanced packaging, particularly in panel processing – an area where we see tremendous opportunity for co-innovation and customer growth in the coming years,” said Dr. Prabu Raja, president of the Semiconductor Products Group at Applied Materials. “We look forward to welcoming NEXX’s talented team to Applied and working with our combined customer base on this exciting new chapter in advanced packaging technology.”
“We are pleased that NEXX will become part of Applied Materials because together we can accelerate the computer industry’s adoption of advanced large format packaging technologies,” said Jarek Pisera, president of ASMPT NEXX. “NEXX products are already strong and we plan to build on our success as part of Applied Materials with a continued focus on innovation, quality and excellent customer service.”
The transaction is expected to close within the coming months and is subject to customary closing conditions. No regulatory approvals are required.
Following the closing of the transaction, the NEXX team will be incorporated into Applied’s Semiconductor Products Group and will remain based in Billerica, Massachusetts.
Forward-Looking Statements
This press release contains forward-looking statements, including statements regarding Applied’s pending acquisition of the NEXX business of ASMPT Limited, expected growth and trends in our businesses and markets, technology transitions and other statements that are not historical facts. These statements and their underlying assumptions are subject to risks and uncertainties and are not guarantees of future performance. Factors that could cause actual results to differ materially from those expressed or implied by such statements include, without limitation: the ability of the parties to complete the pending acquisition on a timely basis or at all; Applied’s ability to successfully integrate NEXX’s operations, products, technology and employees; and other risks and uncertainties described in Applied’s filings with the Securities and Exchange Commission, including Applied’s most recent Forms 10-K, 10-Q and 8-K. All forward-looking statements are based on management’s current estimates, projections and assumptions, and Applied assumes no obligation to update them.
About applied materials
Applied Materials, Inc. (Nasdaq: AMAT) is the leader in materials engineering solutions that underpin virtually every new semiconductor and advanced display in the world. The technology we create is essential for advancing AI and accelerating the commercialization of next-generation chips. At Applied, we push the boundaries of science and engineering to deliver materials innovation that changes the world. More information at http://www.appliedmaterials.com.
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